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 HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : Preliminary Data Issued Date : 1998.08.01 Revised Date : 2001.01.30 Page No. : 1/3
H7812AM H7812BM
Low Current Positive Voltage Regulator Of Surface Mount Device
Description
The H7812_M series of surface mount device regulators are easyto-use devices suitable for multitude of applications that require a regulated supply of up to 100mA. These regulators feature internal current limiting and thermal shutdown making them remarkably rugged. No external components are required with the 7812_M devices in many applications. These devices offer a substantial performance advantage over the traditional zener diode resistor combination, as output impedance and quiescent current are substantially reduced. * Wide Range Of Available, Fixed Output Voltages * Internal Short-Circuit Current Limiting * Internal Thermal Overload Protection * No External Components Required
Absolute Maximum Ratings (Ta=25C)
* Input Voltage................................................... 30 V (5V Through 9V), 35 V (12V Through 18V) * Total Power Dissipation ........................................................................................... Internal limit * Operating Temperature Range ............................................................................ 0 C to +70 C * Maximum Junction Temperature...................................................................................... 125 C * Storage Temperature Range .......................................................................... -55 C to +150 C * Lead Temperature (Soldering 10S).................................................................................. 260 C Typical Application Schematic Diagram
Vin
Vin
3
Vout H7812_M
2
100
1
5.7K
5K
100 1.5K 1.9K Vout 5pF 3.41K 13K
C1
C2
576
3.89K 7.8K
2.23K
A common ground is required between the input and the output voltages. The input voltage must remain typically 2.0V above the output voltage even during the low point on the input ripple voltage. Note : C1 and C2 are required if regulator is located far from power supply filter and load, or oscillation may induced on the loop H7812AM, H7812BM
2.84K GND
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Electrical Characteristics
Vin=19V, Io=40mA, Tj=25C Cin=0.33uF, Cout=0.1uF (unless otherwise noted)
Spec. No. : Preliminary Data Issued Date : 1998.08.01 Revised Date : 2001.01.30 Page No. : 2/3
Symbol
Parameter
Conditions Tj=25C 14.5VVin27V 1mAIo40mA 1mAIo70mA 14.5VVin27V 16VVin27V 1mAIo100mA 1mAIo40mA Ta=25C 16VVin27V 1mAIo40mA Ta=25C 15VVin25V, f=120Hz Ta=25C Ta=25C Conditions Tj=25C 14.5VVin27V 1mAIo40mA 1mAIo70mA 14.5VVin27V 16VVin27V 1mAIo100mA 1mAIo40mA Ta=25C 16VVin27V 1mAIo40mA Ta=25C 15VVin25V, f=120Hz Ta=25C Ta=25C
H7812AM Units Min Typ Max 11.64 12 12.36 11.4 11.4 40 12 12 80 54 140 1.7 12.6 12.6 180 110 100 50 5 1 0.1 V
Vo
Output Voltage
Vo Vo IQ
Line Regulation Load Regulation
mV mV mA mA uV dB mA V Units
Quiescent Current Quiescent Current IQ Change Vn Output Noise Voltage Vin / Vout Ripple Rejection Ipk Peak Output Current VD Dropout Voltage Symbol Parameter
H7812BM Min Typ Max 11.4 12 12.6 11.4 11.4 40 12 12 80 54 140 1.7 12.6 12.6 180 110 100 50 5 1 0.1 -
Vo
Output Voltage
V
Vo Vo IQ
Line Regulation Load Regulation
mV mV mA mA uV dB mA V
Quiescent Current Quiescent Current IQ Change Vn Output Noise Voltage Vin / Vout Ripple Rejection Ipk Peak Output Current VD Dropout Voltage
H7812AM, H7812BM
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
SOT-89 Dimension
Marking :
Spec. No. : Preliminary Data Issued Date : 1998.08.01 Revised Date : 2001.01.30 Page No. : 3/3
C
H
Date Code Part Number
HSMC Logo Package Code
B 1 E F G A 2 3
D
Style : Pin 1.Vout 2.Ground 3.Vin
I
3-Lead SOT-89 Plastic Surface Mounted Package HSMC Package Code : M
*:Typical
DIM A B C D E
Inches Min. Max. 0.1732 0.1811 0.1594 0.1673 0.0591 0.0663 0.0945 0.1024 0.0141 0.0201
Millimeters Min. Max. 4.40 4.60 4.05 4.25 1.50 1.70 2.40 2.60 0.36 0.51
DIM F G H I
Inches Min. Max. 0.0583 0.0598 0.1165 0.1197 0.0551 0.0630 0.0138 0.0161
Millimeters Min. Max. 1.48 1.52 2.96 3.04 1.40 1.60 0.35 0.41
Notes : 1.Dimension and tolerance based on our Spec. dated May. 05,1996.
2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
* Lead : 42 Alloy ; solder plating * Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
* All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
* Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 * Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 * Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5977061 Fax : 886-3-5979220
H7812AM, H7812BM
HSMC Product Specification


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